Statutes > Washington Statutes > Title 28A - Common school provisions > Chapter 28A.525 - Bond issues. > 28A.525.220 - 1984 bond issue for construction, modernization of school plant facilities -- Legislature may provide additional means for payment.

28A.525.220 - 1984 bond issue for construction, modernization of school plant facilities -- Legislature may provide additional means for payment.

1984 bond issue for construction, modernization of school plant facilities — Legislature may provide additional means for payment.

The legislature may provide additional means for raising moneys for the payment of the principal of and interest on the bonds authorized in RCW 28A.525.212 and 28A.525.218 shall not be deemed to provide an exclusive method for the payment.

[1990 c 33 § 469; 1984 c 266 § 6. Formerly RCW 28A.47.845.]

Notes: Severability -- 1984 c 266: See note following RCW 28A.525.210.