PART 413—ELECTROPLATING POINT SOURCE CATEGORY
- 413.01—Applicability and compliance dates.
- 413.02—General definitions.
- 413.03—Monitoring requirements.
- 413.04—Standards for integrated facilities.
- SUBPART A—Electroplating of Common Metals Subcategory (§413.10 to §413.14)
- SUBPART B—Electroplating of Precious Metals Subcategory (§413.20 to §413.24)
- SUBPART D—Anodizing Subcategory (§413.40 to §413.44)
- SUBPART E—Coatings Subcategory (§413.50 to §413.54)
- SUBPART F—Chemical Etching and Milling Subcategory (§413.60 to §413.64)
- SUBPART G—Electroless Plating Subcategory (§413.70 to §413.74)
- SUBPART H—Printed Circuit Board Subcategory (§413.80 to §413.84)